Less On Skin Essence Pad

HOLIKA HOLIKA

Average rating from 0 Ratings

Categories

Face Skincare Masks Leave On & Sleeping Masks

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Categories

Face Skincare Masks Leave On & Sleeping Masks

Less On Skin Essence Pad

HOLIKA HOLIKA

Face Skincare • Masks • Leave On & Sleeping Masks

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Product Ingredient Safety Breakdown (EWG Rating Ratings)

Low Risk
Moderate Risk
High Risk
Unknown

93%

0%

0%

7%

CIR Findings Breakdown

A - Safe as Used
B - Safe with Qualifications
C - Unsafe
Unknown

64%

7%

0%

29%

EWG	CIR	Ingredient Name & Cosmetic Functions	Notes
1	A	1,2-Hexanediol (Solvent)
1	A	Disodium EDTA (Viscosity Controlling,Chelating Agent)
1		Diphenyl Dimethicone (Skin Conditioning,Emollient,Emulsifying,Hair Conditioning,Antifoaming Agent)
1	A	Panthenol (Skin Conditioning,Antistatic Agent,Hair Conditioning)	Promotes Wound Healing Good for Dry Skin
1	B	Centella Asiatica Extract (Skin Conditioning,Cleansing,Soothing,Tonic,Smoothing)	Promotes Wound Healing
1	A	Cellulose (Viscosity Controlling,Absorbent,Bulking Agent,Opacifying,Slip Modifier)
1	A	Ethylhexylglycerin (Skin Conditioning,Deodorant)
1		Bifida Ferment Filtrate (Skin Conditioning)
1		Water (Solvent)
1	A	Butylene Glycol (Solvent,Skin Conditioning,Masking,Fragrance,Humectant,Viscosity Controlling,Viscositydecreasing Agent)	Good for Dry Skin Comedogenic Rating (1)
2	A	Glycerin (Solvent,Perfuming,Fragrance,Humectant,Viscosity Decreasing Agent,Hair Conditioning,Skin Protecting,Denaturant)	Good for Dry Skin
1	A	Triethylhexanoin (Solvent,Skin Conditioning,Masking,Emollient,Fragrance,Antistatic Agent,Hair Conditioning,Refatting)
1		Polyglyceryl-10 Myristate (Skin Conditioning,Surfactant,Emulsifying)	Fungal Acne Trigger
	A	Biosaccharide Gum-4 (Skin Conditioning)

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