C450 Bubble Peeling Pad

WISH FORMULA

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Product Overview

Quick Product Notes
(Click on Icons for more information)

Paraben-Free
Sulfate-Free
Alcohol-Free
Silicone-Free
EU Allergen-Free
Fungal Acne (Malassezia) Safe

Notable Effects & Ingredients


Anti-Aging from 3 Ingredient(s):
Glycolic Acid Ascorbic Acid (Vitamin C) Lactic Acid

Promotes Wound Healing from 1 Ingredient(s):
Hyaluronic Acid

Brightening from 1 Ingredient(s):
Ascorbic Acid (Vitamin C)

Ingredients Related to Skin Types
Click on the arrow next to the Skin Type! Green = Good & Red = Bad

Dry Skin
2
Oily/Acne-Prone Skin
1
Sensitive Skin
1
2

Ingredient Safety Breakdown (EWG Health Ratings)

  • Low Risk
  • Moderate Risk
  • High Risk
  • Unknown
60%
12%
8%
20%

My Ingredient Notes

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Product Ingredient List

(Showing first 5 of 25 Ingredients)
EWG CIR Ingredient Name & Cosmetic Functions Notes
1
Daucus Carota Sativa (Carrot) Root Extract
(Perfuming)
1
A
Disodium Cocoamphodiacetate
(Skin Conditioning,Hydrotrope,Hair Conditioning,Sufactant,Foam Boosting)
1
A
Dipropylene Glycol
(Solvent,Masking,Fragrance,Viscosity Controlling,Viscosity Decreasing Agent)
4
B
Glycolic Acid
(Ph Adjuster,Buffering Agent,Exfoliant)
Anti-Aging
Anti-Aging
Good for Oily Skin
Good for Oily Skin
Bad for Sensitive Skin
Bad for Sensitive Skin
1
Brassica Oleracea Italica (Broccoli) Extract
(Cosmetic Astringent)

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