Baking Soda Cleansing Gel

Keana Nadeshiko

Where to buy Possibly in stock
No retailers tracked yet.

Product Ingredient Safety Breakdown (EWG Rating Ratings)

  • Low Risk
  • Moderate Risk
  • High Risk
  • Unknown
63%
11%
0%
26%

CIR Findings Breakdown

  • A - Safe as Used
  • B - Safe with Qualifications
  • C - Unsafe
  • Unknown
42%
11%
47%
EWG CIR Ingredient Name & Cosmetic Functions Notes
1
Water
(Solvent)
1
A
Dipropylene Glycol
(Fragrance, Solvent, Viscosity Decreasing Agent, Masking, Viscosity Controlling)
4
B
PEG-7 Glyceryl Cocoate
(Skin Conditioning, Emollient, Emulsifying, Surfactant)
Fungal Acne
Fungal Acne Trigger
PEG-20 Glyceryl Isostearate
(Surfactant)
3
PEG-20 Glyceryl Triisostearate
(Skin Conditioning, Emollient, Emulsifying, Surfactant)
Fungal Acne
Fungal Acne Trigger
1
A
Sodium Bicarbonate
(Abrasive, Buffering Agent, Deodorant, Oral Care Agent, Oral Health Care Drug, Phadjuster, Skin Protecting)
1
A
Dipotassium Glycyrrhizate
(Flavoring Agent, Skin Conditioning, Humectant)
Onsen-Sui
Cucumis Sativus Fruit Extract
(Skin Conditioning, Skin Conditioning Emollient)
TOCOPHEROL
(Antioxidant, Fragrance, Skin Conditioning)
1
A
Butylene Glycol
(Fragrance, Skin Conditioning, Solvent, Viscositydecreasing Agent, Humectant, Masking, Viscosity Controlling)
Good for Dry Skin
Good for Dry Skin
1
Glycosyl Trehalose
(Binding Agent, Emulsion Stabilising, Film Forming, Humectant, Skin Protecting)
1
A
Hydrogenated Starch Hydrolysate
(Humectant, Oral Care Agent)
1
Acrylates/C10-30 Alkyl Acrylate Crosspolymer
(Emulsion Stabilising, Film Forming, Viscosity Controlling)
1
A
Glycol Distearate
(Opacifying, Viscosity Increasing Agent, Emollient, Emulsifying, Skin Conditioning, Viscosity Controlling)
Fungal Acne
Fungal Acne Trigger
1
A
Carbomer
(Emulsion Stabilising, Viscosity Increasing Agent, Gel Forming, Viscosity Controlling)
3
B
Potassium Hydroxide
(Ph Adjuster, Buffering Agent)
4
A
Phenoxyethanol
(Fragrance, Preservative)
Paraben
Paraben
PARFUM
(Fragrance, Perfuming)