Repair Mode Bond Building Nail Serum
The OPI Repair Mode Bond Building Nail Serum is a misc. Our analysis of its 4 ingredients (3 low-risk) rates it Excellent (89/100).
Product Ingredient Safety Breakdown (EWG Rating Ratings)
CIR Findings Breakdown
| EWG | CIR | Ingredient Name & Cosmetic Functions | Notes |
|---|---|---|---|
4
|
|
Alcohol Denat.
(Antifoaming Agent, Antimicrobial, Astringent, Masking, Solvent, Viscosity Controlling) |
Bad for Dry Skin
Bad for Sensitive Skin
|
1
|
|
Water
(Solvent) |
|
|
3
|
|
Maleic Acid
(Fragrance, Ph Adjuster, Buffering Agent) |
|
|
1
|
A
|
1,2-Hexanediol
(Solvent) |
