Recover & Restore Damage Repair Hair Mask

Saltair

Recover & Restore Damage Repair Hair Mask

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About this product

The Saltair Recover & Restore Damage Repair Hair Mask is a misc. Our analysis of its 25 ingredients (15 low-risk) rates it Excellent (89/100). Based on its ingredients, it looks well-suited to dry skin. Heads up: it contains fragrance, which can irritate sensitive or reactive skin.

Vegan-friendly Reef-safe

Summarised from our ingredient analysis — not brand marketing copy.

At a glance

Type
Misc
Ingredients
25
Low-risk
15
Fragrance
Contains fragrance
Origin
United States

The evidence

Quick Product Notes

Paraben-Free Sulfate-Free Alcohol-Free Silicone-Free EU Allergen-Free Fungal Acne (Malassezia) Safe

Notable Effects & Ingredients

No Notable Effects & Ingredients

Ingredients Related to Skin Types

Good   Bad — tap a skin type to see which ingredients · estimated from ingredient functions
Dry Skin 4/2
Good for dry skin
Cetearyl Alcohol Isopropyl Palmitate Salvia Hispanica Seed Extract Glycerin
Caution for dry skin
Glycerin Polyglyceryl-10 Laurate
Oily/Acne-Prone Skin No data
Sensitive Skin 1/8
Good for sensitive skin
Glycerin
Caution for sensitive skin
Arginine Isopropyl Palmitate Glycerin Phenoxyethanol Linalool Citronellol Hexyl Cinnamal Hydroxycitronellal

Ingredients list

25 total
Lower hazard (1) Higher hazard (7)
All25 Skin Conditioning15 Fragrance9 Antistatic Agent7 Film Forming6 Masking5 Hair Conditioning5 Emulsion Stabilising4 Perfuming4
EWG CIR Ingredient Name & Cosmetic Functions Notes
1
Water
(Solvent)
1
A
Cetearyl Alcohol
(Emulsion Stabilising, Opacifying, Foam Boosting, Viscosity Increasingagent Aqueous, Viscosity Increasing Agent, Emollient, Emulsifying, Viscosity Controlling)
1
B
Isopropyl Palmitate
(Binding Agent, Fragrance, Skin Conditioning, Emollient, Antistatic Agent, Binding, Perfuming, Solvent)
Bad for Oily Skin
Bad for Oily Skin
Fungal Acne
Fungal Acne Trigger
3
B
Behentrimonium Chloride
(Antistatic Agent, Hair Conditioning, Preservative)
Aspergillus Ferment
(Skin Conditioning)
2
A
Glycerin
(Denaturant, Fragrance, Hair Conditioning, Humectant, Oral Care Agent, Oral Health Care Drug, Skin Protecting, Viscosity Decreasing Agent, Perfuming, Solvent)
Good for Dry Skin
Good for Dry Skin
Fungal Acne
Fungal Acne Trigger
1
A
Arginine
(Fragrance, Hair Conditioning, Skin Conditioning, Antistatic Agent, Masking)
1
Salvia Hispanica Seed Extract
(Emollient, Skin Conditioning)
Itaconic Acid
(Antimicrobial, Buffering, Skin Conditioning, Skin Conditioning Emollient)
MANGIFERA INDICA SEED BUTTER
(Skin Conditioning)
Linum Usitatissimum Seed Extract
(Perfuming, Skin Conditioning)
1
A
Panthenol
(Antistatic Agent, Hair Conditioning, Skin Conditioning)
Good for Dry Skin
Good for Dry Skin
2
B
Acrylamidopropyltrimonium Chloride/Acrylamide Copolymer
(Antistatic Agent, Film Forming, Hair Fixing)
PARFUM
(Fragrance, Perfuming)
4
A
Phenoxyethanol
(Fragrance, Preservative)
Paraben
Paraben
1
A
Guar Hydroxypropyltrimonium Chloride
(Antistatic Agent, Hair Conditioning, Viscosity Increasing Agent, Film Forming, Skin Conditioning, Viscosity Controlling)
1
A
Hydroxyethylcellulose
(Binding Agent, Emulsion Stabilising, Film Forming, Viscosity Increasing Agent, Binding, Stabilising, Viscosity Controlling)
3
A
Polyquaternium-7
(Antistatic Agent, Film Forming, Hair Fixing)
1
A
Ethylhexylglycerin
(Deodorant, Skin Conditioning)
1
Tetrasodium Glutamate Diacetate
(Chelating Agent)
1
B
Polyglyceryl-10 Laurate
(Skin Conditioning, Emulsifying, Surfactant)
5
Citronellol
(Fragrance, Masking)
Allergens
Allergens
5
Hexyl Cinnamal
(Fragrance, Masking)
Allergens
Allergens
7
Hydroxycitronellal
(Fragrance, Masking)
Allergens
Allergens
5
Linalool
(Fragrance, Deodorant, Masking)
Allergens
Allergens

My Ingredient Notes

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Key ingredients

Cetearyl Alcohol
Emollient
Isopropyl Palmitate
Skin Conditioning, Emollient
Aspergillus Ferment
Skin Conditioning
Glycerin
Humectant, Skin Protecting
Arginine
Skin Conditioning
Salvia Hispanica Seed Extract
Emollient, Skin Conditioning

Benefits

Good for dry skin

Concerns

Contains paraben
Contains eu allergen
Not fungal acne (malassezia) safe
Hydroxycitronellal — higher EWG
May not suit sensitive skin

EWG flags hazard, not real-world risk — ratings don't account for how much of an ingredient a product contains. Treat these as things to research, not verdicts. How we score →

Ingredients explained

Water
Solvent
Low-hazard ingredient.Read moreShow less
EWG 1 Solvent
Cetearyl Alcohol
Emulsion stabilising, Opacifying
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A Emulsion stabilisingOpacifyingFoam boostingViscosity increasingagent - aqueousViscosity increasing agentEmollientEmulsifyingViscosity controlling
Behentrimonium Chloride
Antistatic agent, Hair conditioning
Low-to-moderate hazard.Read moreShow less
EWG 3 CIR B Antistatic agentHair conditioningPreservative
Aspergillus Ferment
Skin conditioning
Limited public safety data.Read moreShow less
EWG N/A Skin conditioning
Arginine
Fragrance, Hair conditioning
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A FragranceHair conditioningSkin conditioningAntistatic agentMasking
Salvia Hispanica Seed Extract
Emollient, Skin conditioning
Low-hazard ingredient.Read moreShow less
EWG 1 EmollientSkin conditioning
Itaconic Acid
Antimicrobial, Buffering
Limited public safety data.Read moreShow less
EWG N/A AntimicrobialBufferingSkin conditioningSkin conditioning emollient
MANGIFERA INDICA SEED BUTTER
Skin conditioning
Limited public safety data.Read moreShow less
EWG N/A Skin conditioning
Linum Usitatissimum Seed Extract
Perfuming, Skin conditioning
Limited public safety data.Read moreShow less
EWG N/A PerfumingSkin conditioning
Acrylamidopropyltrimonium Chloride/Acrylamide Copolymer
Antistatic agent, Film forming
Low-hazard ingredient.Read moreShow less
EWG 2 CIR B Antistatic agentFilm formingHair fixing
PARFUM
Fragrance, Perfuming
Limited public safety data.Read moreShow less
EWG N/A FragrancePerfuming
Guar Hydroxypropyltrimonium Chloride
Antistatic agent, Hair conditioning
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A Antistatic agentHair conditioningViscosity increasing agentFilm formingSkin conditioningViscosity controlling
Hydroxyethylcellulose
Binding agent, Emulsion stabilising
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A Binding agentEmulsion stabilisingFilm formingViscosity increasing agentBindingStabilisingViscosity controlling
Polyquaternium-7
Antistatic agent, Film forming
Low-to-moderate hazard.Read moreShow less
EWG 3 CIR A Antistatic agentFilm formingHair fixing
Ethylhexylglycerin
Deodorant, Skin conditioning
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A DeodorantSkin conditioning
+ 2 more — see the full ingredients list above
Isopropyl Palmitate
Binding agent, Fragrance
Potentially comedogenic - can block poresRead moreShow less
EWG 1 CIR B Binding agentFragranceSkin conditioningEmollientAntistatic agentBindingPerfumingSolvent Bad for Oily SkinFungal-acne trigger
Glycerin
Denaturant, Fragrance
Low-hazard ingredient.Read moreShow less
EWG 2 CIR A DenaturantFragranceHair conditioningHumectantOral care agentOral health care drugSkin protectingViscosity decreasing agentPerfumingSolvent Good for Dry SkinFungal-acne trigger
Panthenol
Antistatic agent, Hair conditioning
Low-hazard ingredient.Read moreShow less
EWG 1 CIR A Antistatic agentHair conditioningSkin conditioning Good for Dry Skin
Phenoxyethanol
Fragrance, Preservative
Low-to-moderate hazard.Read moreShow less
EWG 4 CIR A FragrancePreservative Paraben
Citronellol
Fragrance, Masking
Moderate-hazard ingredient.Read moreShow less
EWG 5 FragranceMasking Allergens
Hexyl Cinnamal
Fragrance, Masking
Moderate-hazard ingredient.Read moreShow less
EWG 5 FragranceMasking Allergens
Hydroxycitronellal
Fragrance, Masking
Higher-hazard ingredient.Read moreShow less
EWG 7 FragranceMasking Allergens
Linalool
Fragrance, Deodorant
Moderate-hazard ingredient.Read moreShow less
EWG 5 FragranceDeodorantMasking Allergens

How to use

How to use

  • 1 Morning & evening: Suitable for both AM and PM use.

General guidance from this product's category and active ingredients — always follow the directions on the package.

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